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Kingston Technology KSM26RD8/16MRR memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC1
Kingston Technology KSM26RD8/16MRR memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC1 Kingston Technology KSM26RD8/16MRR memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC2

Kingston Technology KSM26RD8/16MRR memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC

Kingston Technology KSM26RD8/16MRR. Component for: PC/server, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR4, Memory clock speed: 2666 MHz, Memory form factor: 288-pin DIMM, CAS latency: 19, ECC
Manufacturer: Kingston Technology
SKU: 12101571
Manufacturer part number: KSM26RD8/16MRR
Vendor: Synnex
MSRP: $103.00
$76.10
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Kingston's KSM26RD8/16MRR is a 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx8, ECC, memory module, based on eighteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

 

  • 16 internal banks
  • Bi-Directional Differential Data Strobe
  • 8 bit pre-fetch
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • Supports ECC error correction and detection
  • On-Die Termination (ODT)
  • Temperature sensor with integrated SPD
  • This product is in compliance with the RoHS directive
Kingston's KSM26RD8/16MRR is a 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx8, ECC, memory module, based on eighteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

 

  • 16 internal banks
  • Bi-Directional Differential Data Strobe
  • 8 bit pre-fetch
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • Supports ECC error correction and detection
  • On-Die Termination (ODT)
  • Temperature sensor with integrated SPD
  • This product is in compliance with the RoHS directive
Products specifications
Attribute nameAttribute value
Width5.25"
Height1.23"
Lead platingGold
Harmonized System (HS) code84733020
Row cycle time46.25 ns
Refresh row cycle time350 ns
Row active time32 ns
Programming power voltage (VPP)2.5 V
Technical details
Sustainability certificatesRoHS
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Features
Internal memory16 GB
Internal memory typeDDR4
Memory clock speed2666 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCY
Buffered memory typeRegistered (buffered)
CAS latency19
Memory voltage1.2 V
Memory layout (modules x size)1 x 16 GB
Memory ranking2
Module configuration2048M x 72
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Products specifications
Attribute nameAttribute value
Width5.25"
Height1.23"
Lead platingGold
Harmonized System (HS) code84733020
Row cycle time46.25 ns
Refresh row cycle time350 ns
Row active time32 ns
Programming power voltage (VPP)2.5 V
Technical details
Sustainability certificatesRoHS
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Features
Internal memory16 GB
Internal memory typeDDR4
Memory clock speed2666 MHz
Component forPC/server
Memory form factor288-pin DIMM
ECCY
Buffered memory typeRegistered (buffered)
CAS latency19
Memory voltage1.2 V
Memory layout (modules x size)1 x 16 GB
Memory ranking2
Module configuration2048M x 72
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